diff options
| author | Eddy Pedroni <epedroni@pm.me> | 2025-10-13 17:22:31 +0200 | 
|---|---|---|
| committer | Eddy Pedroni <epedroni@pm.me> | 2025-10-13 17:22:31 +0200 | 
| commit | 5a295172693ef9a289d16c24f868caf64156360f (patch) | |
| tree | 17d15a3df5a8a99ab07c6f1f5c79f3a61724808c /power-sequencer-pcb/rev-a/power-sequencer-pcb-job.gbrjob | |
| parent | 2186ed5e273bc7fc6b626eb8e70a924a126ec1b1 (diff) | |
Diffstat (limited to 'power-sequencer-pcb/rev-a/power-sequencer-pcb-job.gbrjob')
| -rw-r--r-- | power-sequencer-pcb/rev-a/power-sequencer-pcb-job.gbrjob | 168 | 
1 files changed, 168 insertions, 0 deletions
| diff --git a/power-sequencer-pcb/rev-a/power-sequencer-pcb-job.gbrjob b/power-sequencer-pcb/rev-a/power-sequencer-pcb-job.gbrjob new file mode 100644 index 0000000..3a34145 --- /dev/null +++ b/power-sequencer-pcb/rev-a/power-sequencer-pcb-job.gbrjob @@ -0,0 +1,168 @@ +{ +  "Header": { +    "GenerationSoftware": { +      "Vendor": "KiCad", +      "Application": "Pcbnew", +      "Version": "9.0.5" +    }, +    "CreationDate": "2025-10-13T17:13:28+02:00" +  }, +  "GeneralSpecs": { +    "ProjectId": { +      "Name": "power-sequencer-pcb", +      "GUID": "706f7765-722d-4736-9571-75656e636572", +      "Revision": "A" +    }, +    "Size": { +      "X": 71.05, +      "Y": 82.55 +    }, +    "LayerNumber": 4, +    "BoardThickness": 1.6, +    "Finish": "None" +  }, +  "DesignRules": [ +    { +      "Layers": "Outer", +      "PadToPad": 0.2, +      "PadToTrack": 0.2, +      "TrackToTrack": -0.0, +      "MinLineWidth": 0.5 +    }, +    { +      "Layers": "Inner", +      "PadToPad": 0.2, +      "PadToTrack": 0.2, +      "TrackToTrack": -0.0, +      "MinLineWidth": 1.0, +      "TrackToRegion": 0.5, +      "RegionToRegion": 0.5 +    } +  ], +  "FilesAttributes": [ +    { +      "Path": "power-sequencer-pcb-F_Cu.gbr", +      "FileFunction": "Copper,L1,Top", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-In1_Cu.gbr", +      "FileFunction": "Copper,L2,Inr", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-In2_Cu.gbr", +      "FileFunction": "Copper,L3,Inr", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-B_Cu.gbr", +      "FileFunction": "Copper,L4,Bot", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-F_Paste.gbr", +      "FileFunction": "SolderPaste,Top", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-B_Paste.gbr", +      "FileFunction": "SolderPaste,Bot", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-F_Silkscreen.gbr", +      "FileFunction": "Legend,Top", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-B_Silkscreen.gbr", +      "FileFunction": "Legend,Bot", +      "FilePolarity": "Positive" +    }, +    { +      "Path": "power-sequencer-pcb-F_Mask.gbr", +      "FileFunction": "SolderMask,Top", +      "FilePolarity": "Negative" +    }, +    { +      "Path": "power-sequencer-pcb-B_Mask.gbr", +      "FileFunction": "SolderMask,Bot", +      "FilePolarity": "Negative" +    }, +    { +      "Path": "power-sequencer-pcb-Edge_Cuts.gbr", +      "FileFunction": "Profile", +      "FilePolarity": "Positive" +    } +  ], +  "MaterialStackup": [ +    { +      "Type": "Legend", +      "Name": "Top Silk Screen" +    }, +    { +      "Type": "SolderPaste", +      "Name": "Top Solder Paste" +    }, +    { +      "Type": "SolderMask", +      "Thickness": 0.01, +      "Name": "Top Solder Mask" +    }, +    { +      "Type": "Copper", +      "Thickness": 0.035, +      "Name": "F.Cu" +    }, +    { +      "Type": "Dielectric", +      "Thickness": 0.1, +      "Material": "FR4", +      "Name": "F.Cu/In1.Cu", +      "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)" +    }, +    { +      "Type": "Copper", +      "Thickness": 0.035, +      "Name": "In1.Cu" +    }, +    { +      "Type": "Dielectric", +      "Thickness": 1.24, +      "Material": "FR4", +      "Name": "In1.Cu/In2.Cu", +      "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)" +    }, +    { +      "Type": "Copper", +      "Thickness": 0.035, +      "Name": "In2.Cu" +    }, +    { +      "Type": "Dielectric", +      "Thickness": 0.1, +      "Material": "FR4", +      "Name": "In2.Cu/B.Cu", +      "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)" +    }, +    { +      "Type": "Copper", +      "Thickness": 0.035, +      "Name": "B.Cu" +    }, +    { +      "Type": "SolderMask", +      "Thickness": 0.01, +      "Name": "Bottom Solder Mask" +    }, +    { +      "Type": "SolderPaste", +      "Name": "Bottom Solder Paste" +    }, +    { +      "Type": "Legend", +      "Name": "Bottom Silk Screen" +    } +  ] +} | 
